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ICCAD中国集成电路设计业2020年会(重庆)

会议主题:ICCAD中国集成电路设计业2020年会(重庆)
会议时间:2020年12月10日
会议时长:3天
会议地点:重庆悦来国际会展中心
参会人数:3000人
会议接待
会场展区待
高峰论坛
展区搭建
会议日程
2020年12月10日,星期四
2Dec. 10, Thursday, 2020
地点:重庆悦来国际会议中心三楼两江厅
Venue: Liangjiang Grand Ballroom, 3F, Chongqing Yuelai International Convention Center
时间
Time
内容
Contents
开 幕 式
Opening Ceremony
主持人:重庆市经济和信息化委员会领导
Moderator: Leader of Chongqing Economic and Information Technology Commission
08:30-09:00中国半导体行业协会领导致词
Address, Leader of CSIA
领导、嘉宾致辞
Address, Leader and Guest
重庆市人民政府领导致辞
Address, Leader of Chongqing Municipal People's Government
高峰论坛
Top Forum
主持人:程晋格,中国半导体行业协会集成电路设计分会秘书长
Moderator: Jinge Cheng, General Secretary, CSIA-ICCAD
09:00-09:30主旨报告
魏少军教授,中国半导体行业协会集成电路设计分会理事长
Keynote
Prof. Shaojun Wei, General Director, CSIA-ICCAD
09:00-09:30重庆市集成电路产业发展情况
重庆市经济和信息化委员会领导
Chongqing IC Industry Development Situation
Leader, Chongqing Economic and Information Technology Commission
09:50-10:10陈立武,Cadence首席执行官
10:10-10:30对半导体产业成长的展望
陈平博士,台积电(中国)副总经理
Semiconductor Growth Outlook
Dr. Peter Chen, Vice President, TSMC China Business Development
10:30-10:50From Mentor EDA to Siemens EDA
彭启煌,全球高级副总裁&亚太区总裁,Mentor, a Siemens business
From Mentor EDA to Siemens EDA
Danny Perng, Senior Vice President, PacRim, Mentor, a Siemens business
10:50-11:10同芯同力,共行致远
葛群,新思科技中国董事长兼全球资深副总裁
One Chip, One World
Qun Ge, Synopsys China Chairman and Global Senior Vice President
11:10-11:30芯火燎原,科创未来
戴伟民,芯原股份创始人,董事长兼总裁
SiPaaS Enables Intelligence of Everything
Wayne Dai, Founder, Chairman, President and CEO, VeriSilicon
11:30-11:50自强自立,共建国产RTL-GDSII数字全流程设计智能平台
王宇成,深圳鸿芯微纳技术有限公司首席技术官
The Introduction of the First Production-Ready RTL-GDSII Digital Design Smart Platform Made by a Chinese Company
Yucheng Wang, CTO, Shenzhen Giga Design Automation Co., Ltd.
11:50-13:15自助午餐 Buffet Lunch
主持人:陈大同,中国半导体行业协会IC设计分会副理事长
Moderator: Mr. Datong Chen, Vice General Director, CSIA-ICCAD
13:15-13:20幸运抽奖 Lucky Draw
13:20-13:40晶圆代工服务:结合当地制造和产品差异化
林伟圣,和舰芯片制造(苏州)股份有限公司销售副总经理
Advantage Of Both Worlds: When Local Manufacture Meets Product Differentiation
W S Lin, Sales VP, HeJian Technology (Suzhou) Co., Ltd.
13:40-14:00芯起点 创未来
彭进,中芯国际集成电路制造有限公司资深副总裁
Advantage Of Both Worlds: When Local Manufacture Meets Product Differentiation
W S Lin, Sales VP, HeJian Technology (Suzhou) Co., Ltd.
14:00-14:20展望Arm计算新时代
吴雄昂,安谋中国执行董事长兼CEO
The New Era of Arm Computing
Allen Wu, Executive Chairman & CEO, Arm China
14:20-14:40华大九天—助力产业人才培养
郭继旺,北京华大九天软件有限公司副总经理
Empyrean Software Empower Talent Development
Jiwang Guo, Vice President, Huada Empyrean Software Co., Ltd.
14:40-15:00通过加速数字化转型,从“新常态”到“更好常态”
孙以山,格芯亚太区业务发展资深总监
From 'New Normal' to a 'Better Normal' Through Accelerated Digital Transformation
Michael Sun, Senior Director, Asia Business Development, GLOBALFOUNDRIES
15:00-15:20赛昉科技引领RISC-V生态发展
徐滔,赛昉科技有限公司CEO
StarFive Leads RISC-V Ecosystem Development
Thomas Xu, CEO, StarFive Technology Co., Ltd.
15:20-15:35茶歇,交流,抽奖Coffee Break, Lucky Draw
15:35-15:55助力国产芯片自主可控一一新时期IP公司的机遇与挑战
邹铮贤,四川和芯微电子股份有限公司董事长兼CEO
Helping Domestic Chips to be Independently & Controllable- Opportunities & Challenges for IP companies in the new Era
Jackie Zou, President & CEO, IPGoal Microelectronics (Sichuan) Co., Ltd.
15:55-16:15服务先行 创新驱动 人才为本
时龙兴,东南大学首席教授,南京集成电路产业服务中心(ICisC)主任,南京集成电路大学校长
Service first, Innovation as Driving Force, Talent is Fundamental
Prof. Longxing Shi, Currently the Chief Professor of Southeast University, the Director of Nanjing Integrated Circuit Industry Service Center (ICisC), The Headmaster of Nanjing IC University
16:15-16:35新市场+新格局 本土IP迎新机遇
向建军,成都锐成芯微科技股份有限公司董事长
The Opportunities of Local IP Industry Brought by Current Markets Environment
Jianjun Xiang, Chairman, Chengdu Analog Circuit Technology Inc.
16:35-16:55新时期第三方专业芯片测试的机遇与挑战
张亦锋,广东利扬芯片测试股份有限公司 CEO
The opportunities and challenges of third party IC testing in the new era
Yeefeng Zhang, CEO, Guangdong Leadyo IC Testing Co., Ltd.
16:55-17:15数字经济双循环,EDA技术突破正当时
王礼宾,芯华章科技创始人、董事长兼CEO
The Dual Circulation of Digital Economy Lays Ground for Breakthrough in EDA Technology
Alex Wang, Founder, Chairman and CEO, X-EPIC
17:15-17:35服务中国芯创业者的思考和探索
摩尔精英MooreElite
Innovation Way to Serve IC Design Start-ups in China
JY Zhang, Chairman & CEO, MooreElite
17:35-17:40幸运抽奖 Lucky Draw
17:40-19:00观展与交流 Visiting Exhibition
19:00-21:00欢迎晚宴(Cadence公司赞助)
Welcome Dinner Banquet (Sponsored by Cadence)
地点:重庆悦来国际会议中心三楼两江厅
Site: Liangjiang Grand Ballroom, Chongqing Yuelai International Convention Center
2020年12月11日,星期五
Dec. 11, Friday, 2020
专题论坛(一)
Subject Forum (I)
地点:重庆悦来国际会议中心一楼欢悦厅A
Venue: Fabulous Function A, 1F, Chongqing Yuelai International Convention Center
时间
Time
内容
Contents
演讲人
Lecturer
EDA与IC设计创新
EDA and IC Design Innovation
主持人:沈磊,中国半导体行业协会集成电路设计分会副理事长
Moderator: Lei Shen, Vice General Director, CSIA-ICCAD
08:40-09:00通过流程重心左移,加速先进技术下的设计实现
Speeding Up Advanced Node Design Implementation by Shifting Left
汤木明,新思科技技术支持副总监
Muming Tang, Sr Manager Application Engineer, Synopsys
09:00-09:20机器学习,让EDA如虎添翼!
Delivering Improved Design Performance by Applying Machine Learning to EDA
刘淼,Cadence公司高级资深总监
Miao Liu, Sr. Product Engineering Group Director, Cadence
09:20-09:40异构验证助力先进节点集成电路设计
Heterogeneous Verification Facilitates Advanced Node IC Design
林俊雄,上海国微思尔芯技术股份有限公司首席执行官&总裁
Toshio Nakama, CEO & President, S2C Limited
09:40-10:00芯片异构集成——超越摩尔定律的时代
The Era of More to Moore – Chiplet Heterogeneous Integration
李立基, 亚太区技术总监,Mentor, a Siemens business
Lincoln Lee, Technical Director, Pacrim, Mentor, a Siemens business
10:00-10:20全流程工具助力电源管理芯片设计方法学创新
Methodology Innovation of Power Management IC Design on Complete AMS EDA System
刘晓明,北京华大九天软件有限公司产品总监
Xiaoming Liu, Product Director, Huada Empyrean Software Co., Ltd.
10:20-10:40新一代技术与EDA的融合创新
Integration and Innovation of New Generation Technology and EDA Technology
祝丹,芯华章科技商务拓展总监
Sarah Zhu, Director of Business Development, X-EPIC
10:40-11:00先进存储器设计的创新EDA解决方案
Innovation EDA Solution for Advanced Memory Design
刘文超,上海概伦电子有限公司副总裁
Wenchao Liu, VP, Primarius Technologies Co., Ltd.
11:00-11:203DIC芯片-封装-系统多物理场协同解决方案
3DIC Chip-Package-System Multiphysics Solutions
姚欣,Ansys半导体事业部主任工程师
Xin Yao, Lead AE, Ansys Semiconductor BU
11:20-11:40OpenEDI:一种开源的电子设计基础构件
OpenEDI: an Open-source Electronic Design Infrastructure
陈刚,EDA创新中心研发副总经理
Michael Chen, R&D VP, Nanjing Industrial Innovation Center of EDA
11:40-12:00Varman:值得信赖的工艺偏差良率分析方案
VarMan: The Trusted Variations-aware design solution
刘客,芯师(上海)电子科技有限公司AE Manager
KeLiu, AE Manager, Silvaco China., Ltd.
12:00-12:05幸运抽奖 Lucky Draw
12:05-13:10自助午餐Buffet Lunch
主持人:刘娜,中国半导体行业协会集成电路设计分会副秘书长
Moderator: Na Liu, Vice General Secretary, CSIA-ICCAD
13:10-13:30先进工艺先进封装电磁仿真的挑战和应对
How to Address the Challenges from Advanced Process Nodes and Advanced Packaging
苏周祥,芯和半导体高级技术支持经理
Zachary Su, AE Manager, Xpeedic Technology
13:30-13:50开源智能物联网处理器平台
Open CPU Platform for AIOT
陈岚博士,中国科学院微电子研究所EDA中心主任
Dr. Lan Chen, Director, EDA Center of Institute of Microelectronics of the Chinese Academy of Sciences
13:50-14:10鸿之微ACAD——原子级TCAD应用解决方案
Hongzhiwei ACAD - Atomistic Level Solution for TCAD Application
曹宇,鸿之微科技集成电路事业部经理
Yu Cao, Manager, Hongzhiwei Tech Co., Ltd.
14:10-14:305G网络芯片的物理设计挑战与技术创新
Physical Design of 5G Networking Chips: Challenges and Innovations
武辰飞,深圳市中兴微电子技术有限公司资深IC设计经理
Chenfei Wu, Snr. IC Design Manager, Sanechips Technology Co., Ltd.
14:30-14:50一站式EDA云端高性能计算平台
EDA Cloud High-Performance Computing Platform
陈琳涛,上海速石信息科技有限公司高级技术总监
Leo Chen,Senior Director,Shanghai FASTONE Information Technology Co., Ltd.
14:50-15:10人才——IC产业创新发展的源动力
Talent - the driving force of IC industry innovation and development
陈琳,成都源矽科技有限公司副总经理
Nemo Chen, VGM, Chengdu Yuan Xi Technology Co., Ltd.
15:10-15:30打造芯片实现工厂,做让客户满意的芯片
Build the Chip Implementation Foundry,Making Chips to Satisfy Customers
闫银宝,上海申首半导体科技有限公司副总经理
Rimbo Yan, VP, Shanghai S1semi Technology Co., Ltd.
15:30-15:50EDA 上云——加速中国“芯”时代
Accelerate Cloud Transformation - EDA on Azure
孙海亮,微软中国半导体行业云负责人
Heidi Sun, Microsoft EDA Industry Executive
15:50-16:10成都芯谷产业发展路径
Chengdu IC Valley Industry Development Planning
贺海华,中电光谷联合控股有限公司 副总裁、成都芯谷产业园发展有限公司总经理
Haihua He, Vice-President, Wuhan Optics Valley United Group LTD.
16:10-16:30智能时代的算力机遇
The Computing Opportunities in Intelligent Era
欧阳剑,百度智能芯片总经理
Jian Ouyang, General Manager, Baidu Intelligent Chip
16:30-16:50以IC竞争力分析的视野深入洞悉ToF芯片
Insight into the ToF Chip with the Help of IC Competitiveness Analysis
琪,苏州芯联成软件有限公司电路工程处经理
Qi Feng, Head of IC Analysis Department, Suzhou Silintech Company
16:50-17:10自主可控可信之高速网络芯片
Self-Controllable and Credible--High Speed Network Chip
杨军,浙江滨芯科技有限公司CEO
Jun Yang, CEO, BINXIN Technology (Zhejiang) Co., Ltd.
17:10-17:30达索系统助力半导体行业数字化转型
Dassault Systems Power the Digital Transformation of the Semiconductor Industry
孙健,达索析统(上海)信息技术有限公司技术顾问
Jerry Sun, Industry Process Consultant, Dassault Systemes
17:30-17:50先进工艺下高性能芯片signoff挑战与EDA解决方案
High-performance Chip Signoff Challenges and EDA Solutions at Advanced Process Nodes
贺青,杭州行芯科技有限公司CEO
ing He, CEO, Hangzhou Phlexing Technology Co., Ltd.
17:50-17:55幸运抽奖Lucky Draw
18:30-20:00闭幕晚宴及交旗仪式
Closing Banquet and Flag Handover Ceremony
地点:重庆悦来国际会议中心一楼喜悦厅
Site: Fiesta Function, Chongqing Yuelai International Convention Center
2020年12月11日,星期五
Dec. 11, Friday, 2020
专题论坛(二)
Subject Forum (II)
地点:重庆悦来国际会议中心一楼欢悦厅B
Venue: Fabulous Function B, 1F, Chongqing Yuelai International Convention Center
时间
Time
内容
Contents
演讲人
Lecturer
IP与IC设计(一)
IP and IC Design (I)
主持人:余成斌,中国半导体行业协会集成电路设计分会副理事长
Moderator: Seng-Pan (Ben) U, Vice General Director, CSIA-ICCAD
08:40-09:00新思科技前沿IP解决方案
Synopsys IP Solutions at the New Era
王迎春,新思科技IP高级技术经理
Yingchun Wang, Sr. Manager of IP Technology, Synopsys
09:00-09:20集成电路公共技术服务平台对产业发展的促进作用
The Promotion Effect of Public Technical Service Platform of IC on Industry Development
李辉,南京集成电路产业服务中心(南京ICC)副总经理
Hui Li, Deputy General Manager, Nanjing IC Industry Service Center Co., LTD.
09:20-09:40星辰处理器赋能AIoT多样化应用
STAR Processor - Enabling Diversified AIoT Applications
陈江杉,安谋中国高级产品经理
Jensen Chen, Senior Product Manager, Arm China
09:40-10:00基于芯原IP的高性能视频转码芯片和开源软件方案
High Performance Transcoding & Open Source Software Solution Based on VeriSilicon IP
汪志伟,芯原股份副总裁,系统平台解决方案部总经理
Wiseway Wang, Vice President and General Manager of System Platform Solution Division, VeriSilicon
10:00-10:20赛昉科技惊鸿7100平台赋能AIoT时代
StarFive Jinghong 7100 Platform Powers AIoT Era
周杰,赛昉科技有限公司销售总监
Jay Zhou, Sales Director, StarFive Technology Co., Ltd.
10:20-10:40面向各种新型应用的完整IP平台,助力产品创新
Complete IP Platform for Various New Applications Facilitates Product Innovation
尚立峰,成都锐成芯微科技股份有限公司技术支持总监
Sam Shang, FAE Director, Chengdu Analog Circuit Technology Inc.
10:40-11:00连结未来:智原5G 网络通信硅智财解决方案
Link to the Future: Faraday 5G Networking IP Solutions
孔晓彬,智原科技ASIC技术顾问
Bruce Kong, ASIC Technical Consultant, Faraday
11:00-11:20“新基建” 时代, SOC助力5G网络部署
5G Network Powered by SOC in “New Infrastructure” Era
郝冬艳,索喜科技(上海)有限公司市场总监
Dongyan Hao, Marketing Director, Socionext Technology(Shanghai) Co., Ltd.
11:20-11:40先进工艺节点上的IP到定制量产解决方案
Highly Customized IP and ASIC Solution for Cutting-edge Process Nodes
高专,芯动科技DDR技术总监
Zachary Gao, DDR Technical Director, Innosilicon Technology Ltd.
11:40-12:00物理安全设计在新兴领域的必要性
The Necessary of Hardware-based Design Security in Emerging Industry
胡逸众,深圳市纽创信安科技开发有限公司IP设计总监
Yizhong Hu, IP Design Director, Open Security Research, Inc.
12:00-12:05幸运抽奖Lucky Draw
12:05-13:10自助午餐 Buffet Lunch
主持人:徐璐琦,中国半导体行业协会集成电路设计分会副秘书长
Moderator: Luqi Xu, Vice General Secretary, CSIA-ICCAD
13:10-13:30落地DTCO,助力中国半导体
From Data to Design Signoff: A Complete EDA Esco-system for DTCO enablement
李严峰,概伦电子执行副总裁,首席产品官
Yanfeng Li, EVP, CPO Primarius Technologies
13:30-13:50台积公司设计生态系统促成创新
TSMC Ecosystem for Innovation
韩晓峰,台积电技术支持资深经理
Evan Han, Technical Support Senior Manager, TSMC
13:50-14:10基于RISC-V指令集创建领域专用处理器
Creating Domain-Specific Processors Based on the RISC-V ISA
相海英, Codasip中国总经理
Tina Xiang, China General Manager, Codasip
14:10-14:30基于TSMC先进2.5D/3D封装技术和GUC GLINK接口IP技术的Chiplets芯片系统互连方案设计实现
Enabling AI/ML, HPC & Networking Products Using TSMC 2.5D/3D Advanced Packaging Technology with GUC's Interface IPs
肖有军,创意电子股份有限公司/上海设计中心总监
YJ Xiao, Director, Global Unichip Corporation (GUC)/CIDS
14:30-14:50雅特力科技——国产高效能Cortex-M4 MCU的创新领导者
Artery Tech-Innovative Leader of High-performance Cortex-M4 MCU
陈佳延,雅特力科技(重庆)有限公司业务处长
Rick Chen, Sales Director, Artery Technology (Chongqing) Co., Ltd.
14:50-15:10基于Linux最小系统的产业链协同创新
Industry-Chain Collaborative Innovation of Linux Minimal System
王路业,深圳优矽科技有限公司总经理
Luye Wang, CEO, Shenzhen UC Techip Co., Ltd.
15:10-15:30RISC-V AI处理器中可变长向量指令在编译器和工具链中的支持
The Implementation of the Variable-length Vector Instructions on RISC-V AI Chips in the Compiler and Tool-chain
王锋,湖南卡姆派乐信息科技有限公司CEO
Feng Wang, CEO, Hunan Compiler Information Technology Co., Ltd.
15:30-15:50Andes RISC-V完整解决方案
Andes’ RISC-V Total Solutions Fuel Momentum
程明明,晶心科技技术服务经理
Albert Cheng, FAE Manager, Andes Technology
15:50-16:10国际化开放式创新平台,加速超越摩尔产业创新
An International Open Platform to Accelerate MtM Innovation
曹明霞,上海微技术工业研究院总监
Jessica Cao, Director, SITRI
16:10-16:305G时代基于异构多核技术的高端芯片定制化设计服务
Hi-end SoC Custom Design Services with Heterogeneous Technology in 5G Era
谷建余,无锡华大国奇科技有限公司 CEO
Jianyu Gu, CEO, Qualchip Technologies, Inc.
16:30-16:50紫光芯片设计云解决方案与最佳实践
UniGroup Cloud-based Solution & Best Practices for IC Design
邓世友,紫光云技术有限公司 CTO办公室主任
Shiyou Deng, Director of UniCloud CTO Office, UNICLOUD TECH CO., LTD
16:50-17:10 安路科技
17:10-17:30SoC IP助力智能计算实现性能、功耗、面积新突破
SOC IP Enables Intelligent Computing Achieve New Breakthroughs in PPA
郑凯,Imagination解决方案高级技术经理
Kai Zheng, Senior Solutions Engineering Manager, Imagination
17:30-17:50芯生态助力万物互联
IC Ecosystem Drive a Connected World
王小华,紫光展锐(重庆)科技有限公司总经理
Xiaohua Wang, General Manager, UNISOC (Chongqing) Technologies Co., Ltd.
17:50-17:55幸运抽奖Lucky Draw
18:30-20:00闭幕晚宴及交旗仪式
Closing Banquet and Flag Handover Ceremony
地点:重庆悦来国际会议中心一楼喜悦厅
Site: Fiesta Function, Chongqing Yuelai International Convention Center
2020年12月11日,星期五
Dec. 11, Friday, 2020
专题论坛(三)
Subject Forum (III)
地点:重庆悦来国际会议中心一楼欢悦厅C
Venue: Fabulous Function, 1F, Chongqing Yuelai International Convention Center
时间
Time
内容
Contents
演讲人
Lecturer
IP与IC设计(二)
IP and IC Design (II)
主持人:李军,中国半导体行业协会集成电路设计分会副秘书长
Moderator: Jun Li, Vice General Secretary, CSIA-ICCAD
08:40-09:00差异化的竞争:先进特色工艺对5G应用产品的设计支持
Competition by Differentiation: Foundry’s Advanced Specialty Technology Platform Design Support for 5G Applications
唐斌辉,和舰芯片制造(苏州)股份有限公司销售经理
Victor Tang, Sales Manager, HeJian Technology (Suzhou) Co., Ltd.
09:00-09:20破生态之殇,创技术之新
Breaking Ecological Dilemma and Creating New Technologies
邹诚,上海睿赛德电子科技有限公司COO
Leo Zou, COO, Shanghai Real Thread Elec Technology Beijing Co., Ltd.
09:20-09:40基于自主IP的高端通用异构芯片的设计和实践
Design and Practice of High-End Heterogeneous General-Purpose Chip Based on Indigenous Ips
张立新博士,华夏芯(北京)通用技术处理器有限公司常务副总
Dr. Lixin Zhang, EVP, Huaxia General Processor Technologies Inc.
09:40-10:00芯片设计云计算发展规划
The Development Plan of IC Design Cloud Computing
王汉杰,摩尔精英IT/CAD及云计算服务副总裁
Johnny Wang, Vice President of IT/CAD & EDA Cloud Service, MooreElite
10:00-10:20IPGoal助力中国芯
IPGoal and the Fast-growing Chinese Chip
罗培君,四川和芯微电子股份有限公司销售经理
Peijun Luo, Sales Manager, IPGoal Microelectronics (Sichuan) Co., Ltd.
10:20-10:40Versatile, Wide Range Multiprotocol SerDes Solutions for Challenging Standards and Applications Including DisplayPort and PCIe5Andrew Cole, VP, Silicon Creations
10:40-11:00芯来科技基于RISC-V处理器的SOC IP平台
Nulei’s SOC IP Platform Based on RISC-V Processor IPs
彭剑英,芯来科技执行总裁
Jianying Peng, Executive President, Nuclei
11:00-11:20灿芯助力中芯国际先进工艺及生态系统
What can Brite Bring to the SMIC Ecosystem?
赵飞,灿芯半导体(上海)有限公司项目管理总监
imothy Zhao, TSM/PM Director ,Brite Semiconductor (Shanghai) Corporation
11:20-11:40多用途的SONOS非易失性存储器
Versatile SONOS Nonvolatile Memory
禹小军,赛普拉斯半导体技术(上海)有限公司资深经理
Xiaojun Yu, Sr. Manager, Cypress Semiconductor Technology (Shanghai) Co., Ltd.
11:40-12:00通过灵活多变的多协议缓存一致性片上网络 (NoC) 优化异构SoC 架构
Optimizing Heterogenous SoC Architectures with Flexible Multiprotocol Cache Coherent Networks-on-Chip (NoC)
曾品翰,Arteris IP应用工程和技术支持部门经理
William Tseng, FAE Manager, Arteris IP
12:00-12:05幸运抽奖Lucky Draw
12:05-13:10自助午餐 Buffet Lunch
主持人:赵建忠教授,中国半导体行业协会集成电路设计分会副秘书长
Moderator: Prof. Jianzhong Zhao, Vice General Secretary, CSIA-ICCAD
13:10-13:30先进制程高速集成电路ESD设计工程实现
ESD Protection Engineering Solutions for High-Speed IC’s in Advanced Technology Node
吴召雷,成都纳能微电子有限公司研发部总监
ZL.Wu, R&D Director, Naneng Microelectronics
13:30-13:50设计服务的新形势
New Situation of Design Service
王建中,上海佩纶半导体有限公司CEO
Jianzhong Wang, CEO, peilunsemi
13:50-14:10新成熟工艺下的SPI NOR和SLC NAND
SPI NOR and SLC NAND Flash in the Mature Process
薛霆,北京兆易创新科技股份有限公司存储事业部市场经理
im Xue, Marketing Manger, GigaDevice Semiconductor (Beijing) Inc.
14:10-14:30芯片设计PCB化,全平台IP助力SoC芯片敏捷开发
ACTT IP Platform Enables Agile SoC Development
杨毅,成都锐成芯微科技股份有限公司副总经理
Yi Yang, VP, Chengdu Analog Circuit Technology Inc.
14:30-14:50国产汽车电子关键技术突破与应用
Breakthrough and Application of Key Technology of Domestic Automotive Electronics
肖佐楠,苏州国芯科技股份有限公司总经理
Joe Xiao, CEO, C*Core Technology Co., Ltd.
14:50-15:10从Silicon到Applications:IEEE全方位使能半导体技术的突破和发展
From Silicon to Applications: IEEE Enables Semi-conductor Technology Breakthrough in the Whole Eco-system
李箐,IEEE亚太区区域经理
Li, Qing, IEEE APAC Area Manager
15:10-15:30Securyzr iSE Automotive, 汽车芯片的安全方案
Securyzr iSE Automotive, The security solution for automotive chipset
汪盛楠,Secure-IC大中华销售和市场经理
Shengnan WANG, Sales & Marketing Manager Greater China, Secure-IC
15:30-15:50从认证到加解密:探索安全芯片技术需求
From Authentication to Encryption: the Research and commercialization of Security Chip
陈帅,飞思灵磐石安全实验室负责人
Shuai Chen, Sponsor and Director of Rock-solid Security Lab, Fisilink
15:50-16:10蓝牙低功耗(BLE)技术特点及其应用发展趋势微
Technical Features and Application Trends in Bluetooth Low Energy (BLE)
张书迁,北京昂瑞微电子技术有限公司市场部高级总监
Shuqian Zhang, Senior Marketing Director, Beijing OnMicro Electronics Co., Ltd.
16:10-16:30立足国产替代,谋求创新发展——高云FPGA的自主之路
Gowin FPGA Development and Innovation Road
王添平,广东高云半导体科技股份有限公司CTO
TP Wang, CTO, Gowin Semiconductor Corp.
16:30-16:50基于RISC-V的嵌入式安全域IP
SECURITY ENCLAVE Based on RISC-V
谢林,Silex Insight大中华区负责人
Tony Tse, Head of Greater China, Silex Insight
16:50-17:10芯生态助力IC设计创新
CMOS Chip Managed to Boost IC Innovation in Design
兰文丽,北京电子城集成电路设计服务有限公司总经理
Wenli Lan, General Manager, Beijing Electronics Zone Integrated Circuit Design and Service Co., Ltd.
17:10-17:30空间音频 – 新一代TWS耳机新体验
Next Generation TWS Design with 3D Audio and Sensor-fusion Solutions
田元,CEVA商务拓展总监
Yuan Tian, Director of Business Development, CEVA
17:30-17:50基于自主IP的AI芯片设计和产品应用
AI SoC Design and Application Based on Proprietary IP
麦振宇,亿智电子科技有限公司战略规划副总裁
Max Mai, VP of Strategy Planing, Eeasy Technology. Co., Ltd.
17:50-17:55幸运抽奖Lucky Draw
18:30-20:00闭幕晚宴及交旗仪式
Closing Banquet and Flag Handover Ceremony
地点:重庆悦来国际会议中心一楼喜悦厅
Site: Fiesta Function, Chongqing Yuelai International Convention Center
2020年12月11日,星期五
Dec. 11, Friday, 2020
专题论坛(四)
Subject Forum (IV)
地点:重庆悦来国际会议中心一楼欣悦厅A
Venue: Felicity Function A, 1F, Chongqing Yuelai International Convention Center
时间
Time
内容
Contents
演讲人
Lecturer
FOUNDRY与工艺技术
Foundry and Process Technology
主持人:张力天,中国半导体行业协会集成电路设计分会副理事长
Moderator: Litian Zhang, Vice General Director, CSIA-ICCAD
08:40-09:005G运用中的模拟芯片
Analog IC in 5G application
秦磊,Tower Semiconductor中国区运营副总裁
Lei Qin, Vice President of China Operations, Tower Semiconductor Ltd.
09:00-09:20联电先进特色工艺
UMC Advanced Specialty Technologies
陈剑波,和舰芯片制造(苏州)股份有限公司销售经理
Snowwolf Chen, Sales Manager, HeJian Technology (Suzhou) Co., Ltd.
09:20-09:40先进特色工艺助力万物智联
Advanced Specialty Technologies Drive a Connected World
田明,上海华力微电子有限公司研发总监
Ming Tian, Senior Director of TD, HLMC
09:40-10:00SMC先进的工艺技术平台和系统整合解决方案
TSMC Advanced Technology Platforms & System Integration Solution
孔玲,台积电(中国)有限公司业务副总监
Yoyo Kong, Deputy Director, TSMC (China)
10:00-10:20格芯技术助力从云到端联接数字化未来
GlobalFoundries Connects the Digitalized Future from Cloud to Edge
朱宇,格芯中国区业务发展总监
Fisher Zhu, Director of China Business Development, GlobalFoundries
10:20-10:40面向高速运算和大容量存储芯片的解决方案——武汉新芯三维集成技术
XMC 3D IC Technology: Solutions for high-speed computing and high-density memory chips
沈亮,武汉新芯集成电路制造有限公司代工市场销售部总监
Neo Shen, Director of Foundry Business, Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
10:40-11:00助力FAB无人化、智慧化生产
Accelerate the Intelligent and Unmanned Manufacturing of FAB
马巍,上海哥瑞利软件有限公司北京分公司总经理、RCM产品总监
Wayne Ma, General Manager of Beijing Branch, RCM Product Director, Shanghai Glorysoft Co., Ltd.
11:00-11:20服务初创芯片企业流片探索
Exploration of Tape-out Service for IC Start-ups
王龙,摩尔精英流片服务总监
Long Wang, Director of Tape-out Service, MooreElite
11:20-11:40全球领先创新中心专家为您所用,助力中国芯片设计
From Prototype to Mass Production - utilize World’s Leading Innovation Center Professionals as Your AssetinIC Design
任旭,欧洲微电子研究中心业务发展经理
Xu Ren, Business Development Manager, imec
11:40-12:00深耕特色工艺,引领智能传感——华润上华特色工艺技术发展介绍
The Overall Introduction of CSMC Specialty Process Technologies Development Status
张森,华润微电子代工事业群研发助理总经理
XSen Zhang, Assistant General Manager of Foundry Business Group, China Resouces Microelectronics Limied
12:00-12:20数据湖平台建设助力晶圆制造缺陷分析
The Architecture of Data Lake Platforms Benefits the Defect Analysis in Wafer Manufacturing
张澄宇,锱云(上海)物联网科技有限公司CEO
Stone Zhang, CEO, Ziyun (Shanghai) IoT Technology Co., Ltd.
12:20-12:25幸运抽奖Lucky Draw
12:25-13:10幸自助午餐 Buffet Lunch
DAC 2021推介会
DAC 2021 Outreach
13:10-13:30设计自动化会议介绍
Introduction to Design Automation Conference
刘大江,重庆大学副教授
Dajiang Liu, Associate Professor, Chongqing University
资本与IC设计业
VC and IC Design Industry
主持人:孙坚,石溪资本管理合伙人、中国半导体行业协会集成电路设计分会副秘书长
Moderator: Jian Sun, Vice General Secretary, CSIA-ICCAD
13:30-13:50半导体产业投资的思考
China IC Industry Investment Opportunities Suggestions
黄庆博士,华登国际董事总经理
Dr. Hing Wong, Managing Director(MD), Walden International
13:50-14:10基业长青 资本助力
How Capital Support a Great Boom
王心然,中芯聚源股权投资管理(上海)有限公司合伙人
Xinran Wang, Partner, China Fortune-tech Capital Co., Ltd.
14:10-14:30构建产业生态,提升投资能力
Building Industrial Ecology and Improving Investment Capacity
苗军,北京中关村集成电路设计园发展有限责任公司董事长
Jun Miao, Chairman, Beijing Zhongguancun IC Design Park Development Co., Ltd.
14:30-14:50注册制下的半导体产业投资探讨
Investment in Semiconductor Industry under Registration System
祁耀亮,元禾璞华董事总经理
Leo Qi, MD, Hua Capital
14:50-15:10石基起堤,溪源汇海
Stone to Build Levee, Creek to form Sea
高峰,北京石溪清流投资有限公司合伙人
Feng Gao, Partner, Stony Creek Capital Co., Ltd.
15:10-15:30半导体热潮下中国半导体发展和投资机遇
Semiconductor Development and Investment Opportunities in China under the Semiconductor Upsurge
苏仁宏,湖杉资本创始合伙人
Tony Su, Founding Partner CEO, Allin Capital
15:30-15:50半导体创业企业全周期金融需求解决方案
Full-cycle Financial Support for IC Startups
黄卫其,摩尔精英产融服务副总裁
David Huang, Vice President of Financial Service, MooreElite
自由研讨 — 创业投资日益成为推动半导体行业创新的关键因素
Free Discussion - Industry VC is Being Key Factor to Promote Semiconductor Industry Innovation Gradually
15:50-16:50研讨嘉宾:陈大同、黄庆、王心然、祁耀亮、高峰、苏仁宏、黄卫其等
从某种意义上来说,目前中美之争表面是贸易之争,核心是科技之争,科技之争就是创新之争,创新之争就是创业之争,创业之争就是创投之争;
当前的国际环境,将中国集成电路行业发展的机遇与挑战同时放大到前所未有的程度,技术、市场、人才、资金各方面资源的快速聚集,其中创业投资行业的参与起到了至关重要的作用。
参与本次自由研讨嘉宾,都是在中国集成电路创业投资领域最活跃最成功的投资机构的投资家,他们将给大家带来怎样的思考与见解呢?
Honored Guests: Dr. Datong Chen, Dr. Hing Wong, Mr. Xinran Wang, Mr. Leo Qi, Mr. Feng Gao, Mr. Tony Su, Mr. David Huang, etc.
In a certain way, the present disputes between China and the USA are on trade on the surface, the core is focusing science and technology, innovation, start-up, even tech industry VC Investments disputes.
At present, International environment is zooming China IC industry development opportunities and challenges to unprecedented situation. Technology, market, talent, capital, etc are rapidly gathering. Besides, industry VC investors are important and influential.
Today the panelists are all most active and successful China IC industry VC investors.What will share today? We are expecting.
16:50-16:55幸运抽奖Lucky Draw
18:30-20:00闭幕晚宴及交旗仪式
Closing Banquet and Flag Handover Ceremony
地点:重庆悦来国际会议中心一楼喜悦厅
Site: Fiesta Function, Chongqing Yuelai International Convention Center
2020年12月11日,星期五
Dec. 11, Friday, 2020
专题论坛(五)
Subject Forum (V)
地点:重庆悦来国际会议中心一楼欣悦厅B
Venue: Felicity Function B, 1F, Chongqing Yuelai International Convention Center
时间
Time
内容
Contents
演讲人
Lecturer
先进封装与测试
Advanced Packaging and Testing
主持人:樊晓华,中国半导体行业协会集成电路设计分会副秘书长
Moderator: Xiaohua Fan, Vice General Director, CSIA-ICCAD
08:40-09:00华宇电子在封测产业的布局与发展
Distribution and Development of Hisemi in IC Assembly & Testing Industry
彭勇,池州华宇电子科技有限公司总经理
Peng Yong, General Manager, Chizhou Hisemi Electronics Technology Co., Ltd.
09:00-09:205G大时代:芯片测试的变革和挑战
5G Big Time: Changes and Challenges of Chip Testing
宋鑫,爱德万测试(中国)管理有限公司专家工程师
Xin Song, Expert Engineer, Advantest (China) Co., Ltd.
09:20-09:40先进封装的协同设计与集成开发
Advanced Package Co-design and Integration Development
李宗怿,长电科技中国区研发中心副总经理
Zongyi Li, Vice General Manager of China R&D Center, JCET Group Co., Ltd.
09:40-10:00SIP封装集成技术及发展趋势
SIP Integrated Technology and Development Trend
徐玉鹏,甬矽电子(宁波)股份有限公司工程副总经理
Alvin Xu, CTO, Forehope Electronic (Ningbo) Co., Ltd.
10:00-10:20微型化真无线蓝牙系统级封装解决方案
SiP & TWS SiP solutions
林志毅,日月光处长
Charlie Lin, Director, ASE
10:20-10:40紧跟市场趋势,助力客户创共赢
Following up the Market Trends, Help Customers Create a Win-win Situation
乔春英,通富微电子股份有限公司市场总监
Elsa Qiao, Marketing Dir, TongFu Microelectronics Co., Ltd.
10:40-11:00创新可靠性工程方法,助推国产芯片高质量发展
Promoting the High-quality Development of Domestic Chips by
Innovating the Reliability Engineering Methods
罗道军,工业和信息化部电子第五研究所分析中心主任
Daojun Luo, Director, CEPREI RAC
11:00-11:20移动时代——超薄集成电路面临的机遇与挑战
Opportunities and Challenges for Ultra-thin Integrated Circuits in the Mobile Era
何忠亮,深圳市鼎华芯泰科技有限公司董事长
Zhongliang He, Chairman, Shenzhen Ding Waa Sam Tai Technology Co., Ltd.
11:20-11:40几种当前主流芯片的测试验证方法
Methods to Verify Chipset in the Industry
任彦楠,是德科技(中国)有限公司大中华区运营经理
Yan-nan Ren, Sales Program and Operation Manager of GCS (Greater China Sales), Keysight Technologies
11:40-12:00先进SiP封装技术
Advanced SiP Package
刘卫东,华天科技技术市场总监
Wade Liu, Technical & Marketing Director, HT-Tech
12:00-12:05幸运抽奖Lucky Draw
12:05-13:10自助午餐Buffet Lunch
主持人:徐秀法,中国半导体行业协会集成电路设计分会副秘书长
Moderator: Xiufa Xu, Vice General Secretary, CSIA-ICCAD
13:10-13:30领跑全球测试,助力中国芯
Leader in Testing, Partner in China Semiconductor Industry
宋涛,泰瑞达(上海)有限公司销售副总经理
Jason Song, Sales Deputy GM, Teradyne(Shanghai) Co., Ltd.
13:30-13:50具有成本效率的MCU/IoT射频测试
Cost Effective RF Test for MCU Chips
陈文建,致茂电子股份有限公司资深销售经理
Wenjian Chen, Senior Sales Manager, Chroma (Shanghai) Co., Ltd.
13:50-14:10先进封装及其对环氧塑封料的要求
The Advanced Packaging and Its Requirements on EMC
谭伟,江苏华海诚科新材料股份有限公司研发经理
Wei Tan, R&D Manager, Jiangsu HHCK Advanced Materials Co., Ltd.
14:10-14:30"芯"体检套餐 - 集成电路先进封装之 DPA 应用与挑战
Application and Challenge of DPA in Advanced Integrated Circuit Packaging
黄志国,苏试宜特(上海)检测技术有限公司副总经理
Russell Huang, VP, CHINAiSTI (Shanghai) Testing Technology Co., Ltd.
14:30-14:50中芯长电先进封装技术介绍
SJSemi’s Advanced Package Technology Introduction
陈明志,中芯长电资深总监
Max Chen, Sr. Director, SJSemi
14:50-15:10物联网模块COS下载和ID地址写入实现方法
The Method of IOT Module COS Download & ID Address Writing
翁小安,北京华安天成智能技术有限公司总经理
Xiaoan Weng, CEO, Beijing Huaan Tiancheng Intelligent Technology Co., Ltd.
15:10-15:30奈米器件的失效分析挑战
Challenge in Failure Analysis of Nano Device
陈志荣,蔚思博检测协理
Phil Chen, Director, VESP Technology Co., Ltd.
15:30-15:50数字化转型在半导体产品开发中的应用
The Future of Semi Test: Applying Digital Transformation Technologies to Semiconductor Product Development
何为,NI全球半导体业务拓展总监
Pearl He, Global Semiconductor BDM Head, NI
15:50-16:10先进工艺赋能系统级封装,满足市场需求
System in Package (SiP) Enables Advanced Technology to Satisfy Market Demands
刘一波,安靠科技市场策略副总监
Elbert Liu, Deputy Director Strategic Marketing, Amkor Technology, Inc.
16:10-16:30质量 产能 效益,探索中国半导体封测新格局
Quality, Capacity, Benefit, Explore the New Ecology of China's OSAT
张君浩,摩尔精英测试服务副总裁
Roy Zhang, Vice President of Testing Service, MooreElite
16:30-16:50 邓钦球,苏州华碧微科检测技术有限公司研发经理
Andy Deng, R&D Manager, Suzhou FALAB Test Technology Co., Ltd.
16:50-17:10扇出型板级封装,实现经济高效集成的异构系统封装途径
Fan Out Panel Level Packaging, a Path to Cost Efficient Heterogeneous Integration for SiP Modules
赵春燕,奥特斯科技(重庆)有限公司研发中心工程技术专家
Allen Zhao, R&D Engineering Specialist, AT&S Technology (Chonqing) Co., Ltd.
17:10-17:15幸运抽奖Lucky Draw
18:30-20:00闭幕晚宴及交旗仪式
Closing Banquet and Flag Handover Ceremony
地点:重庆悦来国际会议中心一楼喜悦厅
Site: Fiesta Function, Chongqing Yuelai International Convention Center
2020年12月11日,星期五
Dec. 11, Friday, 2020
专题论坛(六)
Subject Forum (VI)
地点:重庆悦来国际会议中心一楼欣悦厅C
Venue: Felicity Function C, 1F, Chongqing Yuelai International Convention Center
时间
Time
内容
Contents
演讲人
Lecturer
重庆集成电路创新发展论坛
Chongqing IC Innovation and Development Forum
主持人: 重庆市经济和信息化委员会领导
Moderator: Leader of Chongqing Economic and Information Technology Commission
09:00-09:10介绍嘉宾
Introduce Guests
09:10-09:20重庆市领导致辞
Address, Leader of Chongqing
09:20-09:40嘉宾致辞
Address, Guests
09:40-09:55“高科创芯”集成电路产业智库发布及揭牌仪式
Launch and Unveiling Ceremony of "Gaoke Chuangxin" IC Industry Think Tank Press Conference of IC Industry Think Tanks, Signing and Opening Ceremony
09:55-10:15射频集成电路助力万物互联
RF integrated Circuit Helps Everything Interconnected
徐骅,西南集成电路设计有限公司副总经理
Hua Xu, Vice General Manager, Southwest Integrated Circuit Design Co., Ltd. Chongqing
10:15-10:35集成电路产业发展与人才培养
Integrated Circuit Industry Development and Personnel Training
杨虹,重庆邮电大学光电学院副院长
Hong Yang, Assistant Dean of PE College, Chongqing University of Posts and Telecommunications
10:35-10:55当前半导体行业的投资热点与思考
Investment Hotspots and Viewpoints of Semiconductor Industry
陈大同,北京清芯华创投资管理有限公司投委主席
Datong Chen, Chairman of Investment Committee, Hua Capital Management Co., Ltd.
10:55-11:15射频采样数据转换器技术及发展趋势
RF Sampling Data Converter Technology and Development Trend
付东,重庆吉芯科技有限公司副总经理
Dongbing Fu, Vice General Manager, Chongqing Giga Chip Technology Co., Ltd.
11:15-11:3512吋功率器件的产业现状及发展趋势
Present Situation and Development of Power Devices Made in 12 inch Fabs
李勇强,华润微电子(重庆)有限公司 首席专家
John Li, Chief Scientist, China Resources Microelectronics (Chongqing) Co., Ltd.
11:35-11:50首创高科重庆泛集成电路科技园及产业服务
Introduction for the IC Park in Western Science City of Capital Park and Industrial Service
安侠睿,北京首创高科技发展有限公司副总经理
Xiarui An, Vice General Manager, Beijing Capital Park Co., Ltd.
11:50-12:10高性能模拟集成电路设计——电场传感器接口及驱动电路
High Performance Analog IC Design - Interface and driving circuit of electric field sensor
杨勇刚博士,重庆东微电子股份有限公司总经理
Dr. Yonggang Yang, CEO, Eastmicro Electronics Chongqing Co., Ltd.
12:10-12:15幸运抽奖Lucky Draw
12:15-13:10自助午餐
经典案例

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